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BGA rework station Your location:Home > BGA rework station
Name:

AT-8225 Rework System

Number: AT-8225

Overview:

Description

● Two heating areas design in which upside heating area is designed with hot air, downside area is designed infrared heating. All heating areas could be controlled separately which are equipped with high precision temperature controlling
meters. This product can be configured with eight grades of heating or cooling temperatures and store ten sets of temperature configurations in which external temperature testing terminal equipped to adjust every parameter on time.
● Designed with K-type thermocouple and automatically temperature offset system which is combined with temperature controlling module to control temperature accurately with difference in 2℃, and achieve precision analysis and    
correctness.
● V-type slot design for PCB board to position fast, accurately and conveniently which meets the requirements of various PCB board layouts and positioning.
● Flexible and mobile universal clamp can protect PCB, avoid damage to PCB edge component, avoid distortion to PCB and suitable for reworking of various BGA packaging size.
● Equipped with various nozzles which could be rotated for 360° to be convenient for installation and replacement.
● Eight grades of heating, cooling and constant temperature control.
● Alarming function as desoldering or soldering work completed to prompt operator ready for next procedure. At the same time, automatic or manual enabled high, horizontal air flow fan will be used to cool PCB down before its distortion,
to retain soldering works.
● Approved by CE certification and equipped with automatic cut-out.

Specification

Total power:2800W        
Upside heating power: 800W
Downside heating power: 1800W
Input voltage: AC220V±10%     50/60Hz
Dimension:L470*W370*H500 mm
Positioning manner:V-type slot, PCB support could be arranged  in horizontally and vertically and arranged with universal clamp
Temperature control manner: K-type thermocouple, Closed loop
Temperature stability :±2℃
PCB dimension :Max 300mm*300mm, Min 20mm*20mm
Chips dimension:5*5~55*55mm
Minimum clearance for chips:0.15mm
External temp-testing port:1 (customizable)
Net weight:14.5KG

Package list

BGA rework station   1 Unit
Manual  1 Copy
Nozzle 3 PCS
Shaped clamp  6 PCS
Knob 6 PCS
Horizontal cooling fan 1 PCS
Supporting screw  4 PCS
Data line 1 PCS
Temp-control software disk 1 PCS

Service

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