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BGA rework station Your location:Home > BGA rework station

AT-8235T BGA Rework System

Number: AT-8235T



●This product is designed with HD touch screen, controlled with IPC, CPU and equipped with instant curve analysis function. This device can display real settings, measured temperature curve and correct curves.
●Designed with high precision K-type thermocouple and
automatically temperature  offset system which is combined with temperature controlling module and PLC  to control
temperature  accurately with difference in 2℃.
●This product is equipped with high accuracy digital image recognition system in which PCB board can be positioned
fast, accurately and conveniently on slide along X,Y,Z axis which meets the requirements of various PCB board layouts and positioning.
●Flexible and mobile universal clamp can protect PCB, avoid damage to PCB edge component, avoid distortion to PCB and suitable for BGA reworking of various size. 
●All 3 heating area can be heated up separately and controlled with multiple sets or grades temperatures simultaneously to obtain best soldering effect. All configurations for heating temperature, heating time, slope and cooling can be completed on display screen. 
●Equipped with various alloy nozzles which could be rotated for 360° to be convenient for installation and replacement.
●Six grades temperature control for upside and downside heating area which can be extended to eight grades.
Massive curves can be stored which also can be called for different BGA, be analyzed, configured and modified on touch screen. ALL 3 heating areas are controlled by PID algorithm independently.
●More stable heating and more accurate temperatures.
●High power and high flow fan is used to cool PCB for avoiding distortion. All packaging, soldering and desoldering process is executed automatically and intelligently.
●USB port for USB flash driver to download curves and for   mouse to extend touch screen lifespan.
●Alarming function as desoldering or soldering work completed to prompt operator ready for next step. At the same time, automatic or manual enabled high, horizontal air-flow fan will be used to cool PCB down before its distortion. 
●Approved by CE certification and equipped with sudden-stop switch and automatic cut-out for emergency.


Total power:4800W
Upside heating power: 800W
Downside heating power: 1200W(second heating area), 2700W(Third heating area ,enlarged area for various PCB board)
Input voltage: AC220V±10%     50Hz
Dimension:L500*W600*H700 mm
Positioning manner:V-type slot, PCB support could be arranged in horizontally and vertically and arranged with universal clamp
Temperature control manner: K-type thermocouple, Closed loop
Temperature stability :±2℃
PCB dimension :Max 500mm*400mm, Min 22mm*22mm
Chips dimension:2*2~80*80mm
Minimum clearance for chips:0.15mm
External temp-testing port:1 (customizable)
Net weight:45KG
Operative nozzles: Appendix

Package list

BGA Rework station 1 Unit
Brush 1 PCS
Vacuum pad 3 PCS
Manual 1 copy
Nozzle 4 PCS
Shaped clamp 6 PCS
Knob 6 PCS
Supporting screw 4 PCS
thermocouple wire 1 PCS


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